Hanbin Ying

I am seeking an internship in the semiconductor device physics area.I possess a 4.0 GPA at Georgia Tech with 2 co-authored papers in semiconductor device physics. I had more than a years experience in characterizing semiconductor devices from different platforms and generations (8HP, 9HP from IBM, 3ZL from TI, etc) and investigating semiconductor reliability physics. I frequently used Sentaurus TCAD to analyze device behaviors under reverse breakdown, mixed-mode stress, and low temperature operations. I am also proficient in chip packaging, wirebonding, and PCB soldering. Working as a design verification intern at Echostar Technology for 8 months, I developed excellent multitasking and time management skills with a dedication for work.